Researchers at the National University “MISIS” has created composites that have a much higher conductivity and can be easily recycled.
Using them in modern electronics it is possible to solve the problem of overheating printed circuit boards. The results were published in the journal of alloys and compounds.
Everyone faces the electronic device overheating during operation: the device does not respond and the computer will just shut down. And this is only the visible side of the problem: with the constant overheating, the electronic device can fail. Often, the device will not respond, displays a blue screen of death (BSOD) or shuts down unexpectedly.
The processor and video Card are the most temperature sensitive components of your computer or smartphone. High temperatures shorten their life. Although modern devices are automatically shut down if the temperature reaches a critical level, regular overheating can cause errors CPU or breakage of the chip.
Scientists nust “MISIS” offer a universal approach to manufacturing low cost and lightweight composites with high thermal conductivity and good mechanical properties, at the same time, to solve this problem.
Dmitry Muratov, senior researcher of the Department of functional Nanosystems and high temperature materials, said: “we wanted to create a material with high thermal conductivity, not electrical conductivity, and a polymer matrix, which is potentially cheaper to manufacture and dispose of than current materials.”
According to Muratov, this composite is the most promising for the replacement of reinforced plastics in printed circuit boards or in small devices with high emissivity (e.g., led lamps).
Mrs. scientists used high-density polyethylene (HDPE) as the polymer matrix and two types of hexagonal boron nitride (hbn) as a functional filler. They developed the optimal combination of processing modes to achieve the desired properties of the filler.
“In the end, we saw a positive result: our latest test showed that the strength of the composite based on polyethylene and 24.8 MPa boron nitride with a thermal conductivity of at least two or three times higher than fiberglass, used in such devices” – said Muratov.
The scientist believes that the material can effectively replace fiberglass (material based on fiberglass) in advanced electronics because they do not have the same defects.
The researchers note that it is impossible to properly dispose of or recycle fiberglass for future use. The composite, developed in nust “MISIS” not only has the necessary thermal conductivity (about 1 W/m K), but also can be recycled.
“The economic benefits of our materials are in easy disposal and recycling, as it is very difficult to handle the fiberglass for its polymer component is made from thermosetting polymers: epoxy resins, which cannot be reused after curing,” Muratov.
Nust “MISIS” presented the results of the scientific community at the international Symposium on Metastable, Amorphous and Nanostructured materials in Spain.
Now researchers are collaborating with the University of Nebraska-Lincoln (USA) in the synthesis of two-dimensional materials and exploring their properties. They are looking for a way to dramatically increase the thermal conductivity of composites using materials that should theoretically have the best properties.
Sourse: sputniknews.com
